| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_420909f3b18f3f6382440c8f14f337e5 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0152
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-386
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09118
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0195
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0726
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-068 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4626 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B43-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-20 |
| filingDate |
1983-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3200999c164f585edca8bda2bce017a9 |
| publicationDate |
1984-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0103627-A1 |
| titleOfInvention |
A method and apparatus for manufacturing multi-layer circuit boards |
| abstract |
Method and apparatus (48) for fabricating multi-layer functional assemblies of printed circuit boards (44). According to the method of manufacturing printed circuit board assemblies (44), a printed circuit board (42) is formed with a conductive circuit pattern (18) embedded in a substrate of insulating material (32) and an integral part of the latter, so that the surface of the conductive circuit pattern is exposed along a surface (34) of the substrate, flush and co-planar thereof. At least two of said plates (42) are stacked, a layer of insulating material (44) being interposed between each pair of adjacent plates (42). The entire assembly is hot pressed to form a homogeneous block of insulating material, in which drawings of conductive circuits are embedded and molded to form an integral part thereof. |
| priorityDate |
1982-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |