http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0096034-A4
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f75c33ae35e5d1dc4b05e62ec461c17f |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| filingDate | 1981-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0aa6a19d4d355dc1f3f0e0024e62a97a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a38c9848728c7fbc39812b5f096bd0ec http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7d10b16bf4ae689c347ba6a9b484212a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7b77fd9b79ed3107eb2c7678248aa2a8 |
| publicationDate | 1984-05-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | EP-0096034-A4 |
| titleOfInvention | ELECTRO-FREE COPPER DEPOSITION SOLUTIONS. |
| abstract | Suitably complexed cupric solutions can deposit conductive copper films electrolessly on properly catalyzed non-conductive substrates, at plating bath pH values in the range of about 2.0 to 3.5, using a non-formaldehyde reducer such as hypophosphite. Certain conditions are critical to successful results: (1) ability of the complexer selected to chelate copper at pH values of 2.0 to 3.5 at elevated temperatures (140<o> to 160<o>F); (2) avoidance of certain anions, such as halides and acetates, in significant concentrations in the plating solution; and (3) provision of an "active" catalytic surface on the non-conductive substrate. |
| priorityDate | 1981-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 51.