http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0096034-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f75c33ae35e5d1dc4b05e62ec461c17f |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40 |
| filingDate | 1981-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a38c9848728c7fbc39812b5f096bd0ec http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7b77fd9b79ed3107eb2c7678248aa2a8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0aa6a19d4d355dc1f3f0e0024e62a97a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7d10b16bf4ae689c347ba6a9b484212a |
| publicationDate | 1983-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | EP-0096034-A1 |
| titleOfInvention | NON-ELECTROLYTIC COPPER DEPOSITION SOLUTIONS. |
| abstract | Appropriately complexed copper solutions can deposit copper conductive films on electrically nonconductive catalyzed substrates without passing an electric current, at pH values ranging from approximately 2.0 to 3.5 in the plating bath. using a non-formaldehyde reducer such as hypophosphite. To obtain good results, the following conditions are essential: 1) the complexer chosen must be able to chelate the copper at pH values between 2.0 and 3.5 at high temperatures (140o to 160oF); 2) avoid large concentrations of certain anions in the plating solution, such as halides and acetates; and 3) an "active" catalytic surface must be provided on the non-conductive substrate. |
| priorityDate | 1981-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 51.