| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2b8b744d430e252fa21c14c2b8dee176 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1605
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 |
| filingDate |
1983-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5a26776659c0e21303b4c44575192a5f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5836103fd9220632e62e75ed7fd1f169 |
| publicationDate |
1983-11-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0094711-A1 |
| titleOfInvention |
Method of manufacturing finely structured metal patterns on metal or semiconductor surfaces |
| abstract |
Manufacture of metal patterns on the surface of a substrate consisting of metal or a semiconductor compound while using a mask selected from SiO2 or Si3N4 which is first provided uniformly on the substrate from the vapour phase and is then etched away locally. The exposed parts are metallized by means of an electroless plating bath, if desired after a separate deposition of nuclei. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5527586-A |
| priorityDate |
1982-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |