Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c7ad58d3c0b071069a8ee0cb8c8ba2e8 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31678 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-445 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-445 |
filingDate |
1983-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_90ccb9ede498b5469f5e17b6cf511644 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f4442fc769560867fc0a2c4b8066375a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3540452a15907363503f9369d82afc45 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e5a53bcc114b9d38affa19306ccebdf3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_777cb712e0bfb223b44d624cd747923c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1326d2ec0082e0f8f735a7c8abb0b835 |
publicationDate |
1983-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-0085332-A2 |
titleOfInvention |
Metallised semiconductor and process for its manufacture |
abstract |
The adherent metallization, in particular partial metallization of the surface of semiconductors without pickling, can be achieved by carrying out the activation with organometallic compounds of metals of the 1st and 8th subgroups of the periodic table of the elements and then reducing and metallizing them in the usual manner. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0348119-A3 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0348119-A2 |
priorityDate |
1982-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |