http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0076802-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9fc0a00eab3a757e8324b1e887d7ba97 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-072 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49562 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 |
| filingDate | 1982-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7e8165e3691da7460e34a1ebc9bb9b51 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c354c6ffaa2ed5bef6c4509f70d01ed |
| publicationDate | 1983-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | EP-0076802-A1 |
| titleOfInvention | High current package with multi-level leads |
| abstract | An improved high power semiconductor device (80) and a manufacturing method are described, or one or more dais (64-66) are assembled on an electrode (41) having a heat transfer face (42b) and additional isolated electrodes (47, 53), these electrodes (41, 47, 53) having upwardly folded (43, 49, 55) and folded (50, 83; 44, 84; 56, 58) portions forming terminals high intensity (83, 84) and control terminals (56, 58) so that the high intensity current terminals (83, 84) and the control terminals (56, 58) are in different planes for that the spacings between the terminals (91, 93, 94, 95) respect the recommendations of the 'Underwritters Laboratory'. The canopy and electrode assembly (40) is partially encapsulated, preferably in a plastic (81). The current terminals (83, 84) are located diagonally to facilitate the use of standard busbar devices with different device orientations. Connection nuts (88) are movably retained to limit the transfer of the tightening torque to the plastic body (81). Choices of materials are described. |
| priorityDate | 1981-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.