| abstract |
A liquid casting resin mixture is used to cast pressure-sensitive components, such as semiconductor components (diodes, ICs) or ferrite cores, in a mold. The cast resin mixture contains a low molecular weight epoxy resin, approximately equivalent amounts of a carboxylic acid anhydride as hardener, an accelerator and, if appropriate, inorganic fillers. Either the epoxy or the accelerator or both are based on an N-heterocycle. After the resin mixture has been cured by heating, the coated components are not adversely affected by stresses, since there is little or no reaction loss in the solid phase. |