| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be055db3c1a09879df07379ba969e223 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01024
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01061
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11003 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-86
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4825
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49861 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 |
| filingDate |
1982-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cb5381537bb06f7f41124109dda515ce
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_19686592f8b1a18523b61dd7e8619f2b |
| publicationDate |
1982-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0061863-A1 |
| titleOfInvention |
Method of connecting metal leads with electrodes of semiconductor device and metal lead |
| abstract |
A method for connecting a plurality of metal leads at the same time to electrodes of a semiconductor device. Metal leads (22) each of which has a metal bump (24) bonded thereto with the metal of the metal bump (24) being softer than that of the lead are located above the semiconductor device so that the bumps (24) are in contact with the electrodes (28) of the device. The bumps are then bonded to the electrodes by heating, whereby the metal leads are connected to the electrodes. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4736236-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/FR-2704977-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-RE46466-E
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-RE46618-E
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-RE48420-E
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0370738-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0154187-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0154187-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5066614-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102005051346-B4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102005051346-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5161729-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4784972-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0447170-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0447170-A3 |
| priorityDate |
1981-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |