| abstract |
Cured epoxy compositions are removed from substrates, preferably integrated circuit modules, by contacting the substrates containing said epoxy composition with a removal composition comprising an organic cyclohydrocarbyl alcohol boiling above 110°C, and, if necessary, a minor amount of an organic solvent boiling above 110°C and containing at least one hydroxyl group or a keto group, and a minor amount of a surface-active agent. |