| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_460c960cd09203c2f1727bc268569e14 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01D2201-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01D35-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-285
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-73
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F22-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F299-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-73
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-28 |
| filingDate |
1999-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2007-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9da4c573614af2285edfd406a6c2ca5d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c1325932534675175addff35691a0919 |
| publicationDate |
2007-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-69935758-T2 |
| titleOfInvention |
Adhesive compositions for use in encapsulation package compositions for use in the electronic assembly |
| priorityDate |
1998-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |