| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9ec030fc062b270c25327af9127bed3a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01057
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81206
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09781
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B26B13-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0979
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09436
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0285
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81801
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-328
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10674 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B25F1-003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-562
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-113
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B25F1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-32 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-538
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-485
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate |
2004-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2008-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fe5ab3d10279e3e13fff466376e05864
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e155b562499c43b981b6c2466bdbee7 |
| publicationDate |
2008-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-602004011421-T2 |
| titleOfInvention |
Wiring substrate and electronic component packaging structure |
| priorityDate |
2003-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |