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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22
filingDate 1993-01-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8c816579875a7788efeaab5b6316dd2f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a1e95e374d9ec5f98f1688dc95dbf7d2
publicationDate 1994-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-4300261-A1
titleOfInvention Halogen-free flame-retardant polyamide molding compounds
abstract The moulding materials (I) comprise (A) 10-60 wt.% polyamide, (B) 2-30 wt.% thermoplastic aromatic polymer, (C) 10-50 wt.% Mg(OH)2 and (D) 5-50 wt.% glass fibres.(I) contains 20-45 wt.% (A), 5-25 wt.% (B), 20-40 wt.% (C) and 10-30 wt.% (D). (B) is polyarylene sulphide, polyarylene ether, polysulphone, polyether-imide or aromatic polyamide, esp. poly-p-sulphide. (A) is a partly-crystalline aliphatic homo- or co-polyamide.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9120976-B2
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priorityDate 1993-01-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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