| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4dcde928efabd3987b449889be46c6bc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L91-08 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B27N3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L97-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G14-08 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L91-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J161-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G14-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B27N3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L97-02 |
| filingDate |
1993-01-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1994-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_627bce5d8e2958f4fb44c369d2219b31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_687ab906926141e9a90f9a77fd9c5d03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8a97b6a50cad83703610da4eafd018ef
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a9788ea1ad119b967c8a785546717edd |
| publicationDate |
1994-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-4300035-C1 |
| titleOfInvention |
Process for the preparation of highly reactive urea-modified phenolic resins as binders for middle-layer chips in the production of chipboard |
| abstract |
Prodn. of highly-reactive, urea-modified phenolic resins (I), for use as binder for the middle layer of chipboard, comprises: (a) condensing phenol (II) and aq. HCHO soln. (III) under alkaline conditions until, after addn. of 30-50% urea w.r.t. the condensate, the modified resin contains 50-70% solids and 2-8 (wt.)% alkali (calculated as NaOH) and a viscosity of max. 5000 mPa.s/20 deg.C; and (b) before use, adding enough aq. alkali soln. to this (I) with relatively low alkali content to give the soln. a total alkali content of 7-13% (calculated as NaOH) to ensure fast enough cure on the chips. (II) and (III) are condensed to a viscosity of over 3000, pref. 5000-300000 mPa.s/20 deg.C before adding urea. After addn. of urea, the resin contains 55-65% solids and 4-7% alkali and the viscosity is 100-1500, pref. 200-10000 mPa.s. Before use, the total alkali content is adjusted to 8-12%. ADVANTAGE - The pressing times are the same as or shorter tha those with acid-hardening aminoplastics. The use of (I) saves energy and increases the plant capacity in chipboard mfr. and gives prods. of better quality than usual. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-19919525-C1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0672715-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0672715-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-10060253-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-10060253-B4 |
| priorityDate |
1993-01-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |