| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-3218 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate |
1992-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1998-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d296cef402099b61ca6e9876c10beb8b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_420251efab2cb30b60bceee0fa729345
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a3af280f816f19d47c9a20fcf7ca04a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b310bf05eb2279a070a8d4e3be16990
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9f7350ebbcd3aab1e8124059b59d2b45 |
| publicationDate |
1998-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-4216680-C2 |
| titleOfInvention |
Epoxy resin composition and its use for encapsulating semiconductor components |
| priorityDate |
1991-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |