| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4e58a7247d4c843be828cff866761ddd |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-108
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-072 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-062 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-50 |
| filingDate |
1992-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_29cfd8cac6e158db99d63f895f7e3ba1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_41a6c4e361a6ff9c3bfd2297a7a45cfc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_97babdbd035dcd7d9d0876d28ea2b046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_029e22a19477ef8a9218d518a50f1e92 |
| publicationDate |
1992-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-4201129-A1 |
| titleOfInvention |
WIRING PLATES AND METHOD FOR THE PRODUCTION THEREOF |
| abstract |
A printed wiring board is disclosed, which has one or more copper conductor circuits. It has a palladium coating on at least the copper parts which are provided for mounting components by soldering. A process for the mfr. of the printed wiring board by a pattern plating process or a semi-additive process comprises: (1) forming a Cu pattern by copper electroplating; (2) depositing a Pd coating by electroless plating or Pd electroplating on to the Cu pattern parts; (3) removing the plating resist layer; (4) etching the Cu to be removed; (5) forming a soldering resist pattern. USE/ADVANTAGE - The invention is used in the mfr. of high-density integrated circuits. The Pd coating improves the solderability and protects the copper parts from contamination due to the deposition of solder. In an example, a rolled Cu foil (25 x 225 x 0.3mm) was purified by electrolysis and washed with an acid. A Pd film 0.1 thick was deposited by electroless plating, from a soln. contg. palladium dichloride, ethylene diamine, thiodiglycollic acid, and sodium hydrogen phosphite of pH 8 at 60 deg.C. The coated Cu was washed with water and dried. The solderability was tested before and after heating to 230-250 deg.C. The solderability improved by about 50% compared with a Cu sample without a Pd coaing, both before and after heating |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1956114-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1852525-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7887692-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5882736-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008092708-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1087648-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1087648-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6698648-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6737173-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-10018025-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0697805-A1 |
| priorityDate |
1991-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |