| abstract |
The integrated circuit is contacted on a conductive track structure with its active side pointing downwards towards the track structure in flip-chip mode. The integrated circuit is secured by an organic resin, contg. highly conductive particles with irregular structure. Pref. the particles consist of ceramic particles coated with graphite, alternately they are suitable grain size crystals, also coated with graphite. The particles may be ceramic or quartz particles, coated with pyrolytic carbon. Metal film may be also used as particle coating. The grain size is typically between 3 and 50 microns. USE/ADVANTAGE - For tape automated bonding, also for contacting IC directly onto LCD using Chip-on-Board method. Reliability of hybrid circuit or flip-chip assembly is increased. Weight is reduced. |