| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-226
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-245 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate |
1991-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9f7350ebbcd3aab1e8124059b59d2b45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d296cef402099b61ca6e9876c10beb8b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_420251efab2cb30b60bceee0fa729345
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a3af280f816f19d47c9a20fcf7ca04a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e6c3dfe871feb22d17dc35fa608662b0 |
| publicationDate |
1992-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-4135533-A1 |
| titleOfInvention |
EPOXY RESIN COMPOSITIONS AND ENCLOSED SEMICONDUCTOR DEVICES |
| abstract |
Epoxide resin consists of (I) a mixt. of (a) an epoxide resin with at least 2 epoxide gps./mol. and (b) an epoxide resin (I) of the formula :. Glyc-(O-Phe-Phe-OCH2CH(OH)CH2-)n-O-Phe-Phe-O-Glyc. Glyc = glycidyl; Phe = a phenylene gp. with up to 4 halogen or 1-5C monovalent hydrocarbyl substits.; n = 0-5; in an (a)/(b) wt. ratio of 0/100 to 95/5, and (2) a phenolic resin, such that (pt. of) (a) and/or (2) contains (substd.) naphthalene ring(s). Pref. the naphthalene ring content of (1) and (2) is 5-80 wt.%. (1) and (2) are mixed in such amts. that the ratio of epoxy gps./phenolic OH gps. is 0.5-51.5. The compsn. may also contain 100-1000 wt.% inorg. filler w.r.t. (1) + (2). USE/ADVANTAGE - The compsn. is claimed for encapsulating semiconductor devices. It has better flow than usual and cures to prods. with low coefft. of expansion, high Tg, low stress, low elastic modulus, good adhesion and low moisture absorption. It can withstand thermal shock during assembly and is very reliable |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9508584-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5597876-A |
| priorityDate |
1990-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |