| abstract |
Method for mounting the housing of a semiconductor device, comprising the following steps: Preparing a lead frame (21) having a contact surface (22) for receiving a chip (30), spacers (23) for maintaining an equal spacing between adjacent outer leads (24a), and inner leads (24b); Erstumsspritzen a portion of the inner leads (24b), wherein the wire-bonded portion of the inner leads (24b) is not encapsulated, so that the inner leads (24b) are fixed in the further encapsulation; Second injection molding of the inner leads (24b) using an injection mold (27a, 27b) to form a step-shaped housing (29), wherein the part of the inner leads (24b) to be wire-bonded is partially encapsulated so that this portion of each remaining inner lead (24b) exposed on the housing surface and the upper part of the housing (29) is open; and Bonding the chip (30) to the contact surface (22) of the leadframe (21) and then bonding wires (32) between the respective exposed inner leads (24b) and bond pads ... |