| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fbd7063eee731fa36db57b14b15418d3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15153
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10161
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15787
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0102
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16195
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-49
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05554
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49121
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49175 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-057
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-565
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-50 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-057
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-08 |
| filingDate |
1991-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3fc505c4b8a440294cb2d53cbe9de34e |
| publicationDate |
1992-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-4135189-A1 |
| titleOfInvention |
METHOD FOR ASSEMBLING THE HOUSING OF A SEMICONDUCTOR COMPONENT |
| abstract |
The leadframe is stiffened by spraying plastic over a part of the leadfingers which will later be embedded in the moulding cpd (EMC). A package (28) with a cavity is formed by a second moulding process in which parts of the leadfingers (24) are embedded. The die is attached to the die-paddle (22) and wirebonded to the free inner ends of the leadfingers (24b), and the cavity is then sealed using a lid. The dambars are removed and the external leads formed. ADVANTAGE - Package is inexpensive to mfr. because of low cost of materials compared with ceramic packages. Assembly process is simplified. Reject level in assembly is reduced because stiffening of leadframe keeps fingers at constant distance and chip- and wire-bonding is carried out after package is formed. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1628338-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-10348253-B3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8110437-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-10221857-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-4319786-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-4424541-A1 |
| priorityDate |
1990-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |