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publicationDate 1992-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-4108981-A1
titleOfInvention ARRANGEMENT AND METHOD FOR HEATING OUT AT LEAST ONE HEAT SOURCE
abstract A thermo-siphon circuit (10) is used to remove the heat generated by electronic equipment. The heat source (2) is connected to an evaporator (4) connected by a pipe (8) to a condenser (6) with a return flow pipe (9) for the refrigerant which circulates in the system. The vaporising pressure of the refrigerant is regulated and only refrigerants which meet the following criteria are used. The ozone depletion potential (ODP) is less than 0.06 of the ODP of Freon II (RTM) and global warming potential (GWP) or greenhouse effect is less than 0.35 of the GWP of carbon dioxide. ADVANTAGE - Cooling of electronic equipment by method which does not harm environment.
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