| abstract |
Microcircuits, having high numbers of connections and connection densities, are contacted and encapsulated using solder laser. The improvement is that a high-polar microelectronic element (integrated circuit) is provided with solder protuberances of different shape and height, using the solder laser, and is testably fixed on a substrate, as a film which can be coiled and un-coiled, and which is provided with stepped substrate inlets (I), and is contacted and encapsulated with inlets (I0, via laser-transparent contact-film segments e.g. of polyimide copper (II). Segment (II) are provided with conductor sheets of solderable material, which are associated geometrically with the solder protuberances and conductor sheets are correlated on the steps of inlets (I). ADVANTAGE - Use of circuits with high connection- and packing densities is enabled. |