| abstract |
To bond electrical components to the conductors of circuit boards, using laser soldering, soldering sections (3) are fixed to the connections (5) of the component (B3) by adhesive. The component (B3) is placed on the connection surfaces (3) of the substrate (1). The laser beam is passed over the connections (5) of the component, and the connection surfaces (2) of the substrate (1), to melt the soldering sections (3). The component (B3) is adhesive bonded to the connection surfaces (2) of the substrate. The pref. adhesive is rosin dissolved in alcohol with or without activating additive(s). The component (B3) is secured to the substrate by self-adhesive plastics balls (6). The soldering sections (3) are flat rings, discs, platelets or strips with round or polygonal profiles. USE/ADVANTAGE - The system gives an effective soldering action, without the development of solder balls. |