| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5d7576285d411d00c697e07270d2814a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0017
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0394
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0112
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-128 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-0056 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
1990-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e3db30e65cbe3244f3c065184884b8c4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ddb6c7235ae1822758e05fe76cfe92e6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e75ec05d6c530bcd9c7440b2d0eea425
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0dac2789861c0af8f0297407fcaa8ea1 |
| publicationDate |
1990-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-4010899-A1 |
| titleOfInvention |
MULTI-LAYER PCB |
| abstract |
A multilayer electrical circuit board is produced with a number of layers of material (2a, 2b, 2c) that are set into a main body of insulating material, such as a polyamide. The inset layers are produced of a material that can reflect a laser beam (8) and can be in the form of copper with sections roughened (6) by photo etching a masked pattern. Specific locations can be perforated by application of the pulsed laser. At these locations the layers are melted and form a localised connection with the layer beneath. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9820529-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9820534-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6130015-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9820527-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0601375-A1 |
| priorityDate |
1989-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |