| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_da54f7ebbd2d9d8a82f92aca4d1b4e48 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-35
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-172
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1545
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-108
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0082 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-402
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10 |
| filingDate |
1989-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_23d10b3d93d4ee8c88caaa0b1cf428a0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_94a5301ada10b108cd4e0d1848ee6b87 |
| publicationDate |
1991-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-3922478-A1 |
| titleOfInvention |
METHOD FOR STRUCTURING BASE MATERIAL |
| abstract |
(A) Structuring or etching of a plastics coated Cu clad base material is effected by pulsed irradiation with light, the novelty being that an excimer laser is used for the irradiation. (B) Appts. for carrying out the process is also claimed. Fine and ultra-fine conductor line structures are produced on rigid and flexible base materials by structuring the desired line pattern on the coated Cu clad base material by means of an excimer laser using a mask or by direct image scanning using a scanner; forming the conductor lines by metal electrodeposition and removing the coating and etching the Cu in conventional manner or by use of an excimer laser. USE/ADVANTAGE - The process is useful for photoresist-free prodn. of fine circuit structures on circuit board substrates. It avoids the expense and pollution of conventional photochemical process steps. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0790123-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8287703-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-10357525-B3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8551308-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0790123-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-19810809-C1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7892849-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0535620-A1 |
| priorityDate |
1989-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |