| abstract |
The positive-working photoresist composition contains an alkali-soluble synthetic resin, for example a cresol-novolak resin, as film-forming component and a 2,3,4,4'-tetrahydroxybenzophenone 1,2-diazidonaphthoquinone-5- or -4-sulphonate as photosensitive component. Thanks to this photosensitive component, the photoresist composition has higher photosensitivity and heat resistance than conventional photoresist compositions, which contain a 2,3,4-trihydroxybenzophenone 1,2-diazidonaphthoquinonesulphonate, and can be used for the production of fine image patterns for semiconductor devices. |