| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1612
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-184
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1868
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1879
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-182
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1608
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1831 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| filingDate |
1985-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1988-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ad8be1f04c0976b2fa77380c7f07e9d5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_63cbb8ef06b9e124fabe738ba2b2a15d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_901bba1d8970b251d0f1aaaacaf56b09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a84a1b6f69ad8c4934c3f366c58abca2 |
| publicationDate |
1988-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-3563635-D1 |
| titleOfInvention |
A method of depositing a copper pattern on a substrate |
| priorityDate |
1984-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |