| abstract |
A photosensitive resin composition is described which a) at least one compound from the group benzotriazole, benzimidazole, benzothiazole, derivatives and salts thereof, b) a phosphate compound with photopolymerizable unsaturated bonds, c) if necessary an organic thermoplastic polymer, d) a photopolymerizable unsaturated one Compound with at least one terminal ethylene group and e) a sensitizer and / or a sensitizer system which is capable of initiating the polymerization of the unsaturated compounds b) and d) after exposure to actinic light. Furthermore, a photosensitive member is described which comprises a layer of said photosensitive resin composition and a support film therefor. The photosensitive resin composition can form a protective film excellent in adhesiveness to the substrate surface. Such a protective coating film or a photosensitive member obtained therefrom can be used with advantage as a masking agent for solder masks, etc. |