http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-3146149-A1

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ec120db746f2304879cd949c026e98ca
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F1-54
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F1-54
filingDate 1981-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_20376080002301f175eed21b9129a177
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b38ee03843de6988eba723540f12d7d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bde2311f4b2b4ffb334165844a4c2ecb
publicationDate 1983-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-3146149-A1
titleOfInvention EXPOSURE MASK FOR THIN LAYER TECHNOLOGY
abstract The invention relates to an exposure mask for thin-film technology, in particular for structuring semiconductor components. The object of the invention is to produce semiconductor structures with high structural precision and component density at low cost. The invention proposes producing the structure-determining layer of an exposure mask for thin-film technology from amorphous carbon. The amorphous carbon layer is produced by already proposed ion-assisted vacuum coating processes. The advantage of the inventive achievement is that the carbon layer has favourable transmission and blocking properties for visible light or UV light. Furthermore, the structure is extremely abrasion-resistant and line widths of down to 1 mu m are achieved.
priorityDate 1981-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559581
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID297
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419482221
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID24485

Total number of triples: 17.