| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0efa077d881a96aeb1e29b21ef1bbb58 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L97-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B27N1-003 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B27N1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L97-02 |
| filingDate |
1978-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a5d45cefb95a48c3deab68342ecca203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c52ce221fe8b5217239738972ef5564
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_14d952c6d8a770bed141d04fc67d908f |
| publicationDate |
1979-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-2811593-A1 |
| titleOfInvention |
METHOD FOR MANUFACTURING CHIPBOARD |
| abstract |
In the prepn. of multilayer chipboard from adhesive coated wood chips, wood fibres and/or other lignocellulosic contg. materials which are spread in >=3 layers and then hot pressed and in which the covering layers contain a different adhesive from that used in the middle layer, the covering layers contain a polyvalent isocyanate as adhesive and >=1 middle layer contains an aminoplast or phenoplast as binder. The boards can be used in building or as wall coverings as they can be coated and have high water and alkali resistance, hardness, and strength. There is no trouble due to HCHO formation as the outer layers use the isocyanate as adhesive. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0028382-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/FR-2592382-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0232642-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/RU-2493000-C2 |
| priorityDate |
1978-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |