http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-2634232-A1

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-36
filingDate 1976-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_51e8c3c2437ef55fe4ccb69230ab71a6
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publicationDate 1978-02-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-2634232-A1
titleOfInvention METHOD FOR DEPOSITING NICKEL-PHOSPHOR LAYERS
abstract Nickel-phosphorus layers are formed by electroless plating on activated non-conducting substrates, pref. to mfr. passive components, esp. resistors with a low temp. coefft. of resistance (TCR). An aq. plating bath is used contg. Ni ions, hypophosphite ions and (a) a hydroxy-polycarboxylic acid, or an amino acid forming a Ni complex soluble in an alkaline pH. A pH of 8-14 is maintained during plating, and the coating obtd. is heat treated. (a) is pref. malic acid; citric acid; glycine; or alanine; and a constant bath pH is employed to obtain a specific TCR, esp. by using a phosphate, borate or citrate as a buffer. A specified surface resistivity is pref. obtd. by adjusting the plating time. The coating is pref. heated 2 h at 80-100 degrees C. A homogeneous, fine grained layer can be obtd. with a phosphorus content high enough to obtain a TCR 20 ppm/degrees C. The plating bath is stable, so a close tolerance can be achieved on the desired surface resistivity, the latter being obtd. by the immersion time.
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priorityDate 1976-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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