http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-2614840-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1dcc0decc3f333cad0a80a7b4a0b4f49 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-321 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-095 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-32 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 |
| filingDate | 1976-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3caa333906702cec91c160e20892f935 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fcab98774ee97179dad1d8ca2ddb3cd4 |
| publicationDate | 1977-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | DE-2614840-A1 |
| titleOfInvention | ELECTRICALLY CONDUCTIVE RESIN COMPOUNDS AND PROCESS FOR THEIR PRODUCTION |
| abstract | The compsns. contain an intimate mixt. of (a) a relatively H2O free prepolymer phenol resin with low viscosity, contg. H. CHO which can be set free within the compsn., and (b) 50-90 wt. % of a particle form metal filler from oxide coated Cu and/or oxide coated Cu alloys. In an example, 5 pts. wt. of phenol resin (trimethylolallyl phenol), 5 pts. wt. of epoxide resin (DER 736 Dow Chemical Co.) and 90 pts. wt. of Cu powder (325 mesh) were mixed and hardened at 150-200 degrees C for 1/2-1 hour. H. CHO set free in the hardening reduces any Cu oxide film present on the Cu particle to result in an electrically conducting compsn. The oxide film in the Cu used is removed by free H. CHO released on hardening. The solid resin type compsns. have a conductivity similar to those in which Ag is used and are more economic. Since a catalyst is not essential, or if used is not in excess, the compsns, have a long pot-life i.e. >=1 year at room temp. The prods. are used for e.g. resistance elements, the repair of printed circuits, conductors on glass for e.g. de-icers, conducting adhesives for electronic equipment. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-3147123-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-3102015-A1 |
| priorityDate | 1976-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 55.