| abstract |
Protecting transistor and condenser installations, e.g. gauge wire connections in electronic installations, e.g. hybrid integrated circuits, composite pts., electric light indicator circuits, is effected by (a) sprinkling on a powdery epoxy resin compsn. contg. (1) a bis-phenol A-type epoxy resin (I) and (2) diaminodiphenyl methane, tetrahydrophthalic acid anhydride, 2-Et-4-Me-imidazole and/or phenolnovolak; (b) melting compsn. by heating and (c) hardening. Pref. (I) has 400-3000 epoxy equiv. Particle size of compsn. is such that 100% of powder passes through a 100 mesh (0.149 mm) screen and contains =50 wt.% of =44 mu particles. 0.5-1.5 equiv. of hardener (2) are pref. used for each epoxy equiv. |