http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-2155073-A1

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36f1a85bb2f0d2ab4936707ba5915081
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-06
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-06
filingDate 1971-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_731d66e6e020c2250014c2b6f63ff21e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_87dccbc0c3a9d88d24658b5c2be5f1cb
publicationDate 1973-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-2155073-A1
titleOfInvention PROCESS FOR CURING PHENOLIC RESIN COMPOSITIONS WITH SWELLING
abstract Hardening, with irreversible swelling, of phenol resin compsns. contg. alkyl-substd. phenol, phenol and HCHO, esp. single-stage resins with 1:1:4 alkyl phenol : phenol: HCHO ratio, hardeners and opt. fillers is effected in 2 steps : (1) pre-hardening with acids at =120 degrees C and (2) second curing above 120 degrees C. Hardener acids may be organic sulphonic acids, esp. 4-phenolsulphonic and/or sulphamic acids, and/or their chlorides. Inert fillers may be C, powdered quartz, kaolin and/or asbestos. Products are useful as components for putties and sealing materials and moulded articles in which shrinkage in use must be avoided.
priorityDate 1971-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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