Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-04 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36 |
filingDate |
1971-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
1975-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
1975-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
DE-2102734-C3 |
titleOfInvention |
Method for attaching semiconductor components |
priorityDate |
1971-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |