http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-19962702-B4
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d12f09e2e9797cb2f098f10afcf35c05 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-325 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R12-57 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-112 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R12-716 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0483 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-32 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R33-76 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 |
| filingDate | 1999-12-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2008-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d310ffcc671c4306432ac8e3d7979cd0 |
| publicationDate | 2008-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | DE-19962702-B4 |
| titleOfInvention | Test socket of a BGA device |
| abstract | Test socket with a contact element block (10, 30, 40), the is provided with a plurality of passage openings (12, 123, 131b), - Wherein an inclined surface (11 a, 122 a, 131 a) is provided in an upper region of each through hole (12, 123, 131 b), and - wherein the inclined surfaces (11a, 122a, 131a) of the through holes (12, 123, 131b) for applying a uniform pressing force to the respective surface of a plurality of solder balls (1a) of a ball grid array device (1) are formed when the ball grid array device (1 ) is brought into contact with the contact element block (10, 30, 40) under a pressing force, and a housing (20, 110) provided with a contact element block recess (21) for mounting the contact element block (10, 30, 40) and a holding section (22, 23, 111a, 111b, 221, 222) for receiving the ball grid array device (1), characterized in that the inclined surfaces of the through-hole (12, 123, 131b) and the inner surface of the through-hole (12, 123, 131b) are provided with a ... |
| priorityDate | 1998-12-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 28.