http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-19958077-A1

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C30B33-00
filingDate 1999-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aeaf4a6671af78313b7a0796b09f2c63
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publicationDate 2001-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-19958077-A1
titleOfInvention Process for double-sided polishing of semiconductor wafers
abstract The invention relates to a method for double-sided polishing of semiconductor wafers, essentially comprising the following individual steps: DOLLAR A (a) simultaneous polishing of the front and the back of semiconductor wafers with the supply of an alkaline polishing sol between two rotating polishing plates, both of which are covered with a polishing cloth are; DOLLAR A (b) treating the front and back of the wafers simultaneously immediately after step (a) while adding one or more liquids to achieve complete wetting of the front and back of the wafers with a film; DOLLAR A (c) picking up the semiconductor wafers processed according to steps (a) and (b) from one of the two polishing plates by means of a vacuum suction device and transferring the semiconductor wafers into an aqueous bath and DOLLAR A (d) cleaning and drying the semiconductor wafers.
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priorityDate 1999-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 38.