http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-19957067-A1

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fab5a78161702097f97524ce6e5cdcd7
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1619
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16
filingDate 1999-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c3be04d85fa8334bcc45c569c7225fd
publicationDate 2001-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-19957067-A1
titleOfInvention Electroless metal deposition monitoring method
abstract The invention relates to a method for monitoring the electroless metal deposition by measuring the current between an active test substrate (2) located in a metallization solution (1) and a counter electrode (3), characterized in that DOLLAR A - the test substrate (2) during the Coating is suddenly impressed with a potential shifted in relation to the deposition potential into the anodic region, DOLLAR A - the current which is subsequently established between the test substrate (2) and counter electrode (3), DOLLAR A - and from the current-time curve (11) the necessary correction of the stabilizer concentration in the metallization solution (1) is derived. DOLLAR A An arrangement is described. DOLLAR A By measuring the current between the test substrate and the counter electrode, unambiguous statements about the status of the stabilization can be obtained.
priorityDate 1999-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 27.