abstract |
A thermosetting resin composition is described for a build-up process comprising (A) an epoxy resin with two or more glycidyl groups, (B) a curing agent for the epoxy resin, (C) a poly (ether sulfone) and (D) an inorganic filler. The thermosetting resin composition, unlike a relevant conventional resin composition, is not impaired in its processability and provides a curing product with outstandingly low thermal expansion and water absorption. |