| abstract |
A paste for the screen printing of electrical structures on carrier substrates, in particular ceramic carrier substrates, is proposed which contains a mixture of inorganic solid particles with a high sintering temperature and an inorganic binder with a low sintering temperature below the sintering temperature of the inorganic solid particles, dispersed in a vaporizable organic binder, wherein the inorganic solid particles with a high sintering temperature are at least partially in the form of fibers. The fiber components in the printing paste can increase the strength and break resistance of the printed and subsequently fired electrical structures, such as resistors and cover layers. |