| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_80787665b837ed3eb503bbcd27c0043a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1121
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3463 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3494
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-0056 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
| filingDate |
1999-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f4b543e0b70da14d1bf2a7f062bacf8d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8972301caa9278640b07647bdb6f4f28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8471a247a50e936147e9ee9a2b106ff0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e0c5954eb9e1f8f3081b296870536e94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c7e0eaa7a52d915d670bfaa2dea4df9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_43fe35155c2929972b50a879a3925bc4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_766e781967f825ae72cebc28116d37b1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8fb7e412d2bf8c5bb2c648040fbbb574 |
| publicationDate |
2000-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-19925652-A1 |
| titleOfInvention |
Method and device for producing a printed circuit board for an electronic circuit |
| abstract |
A method and a device for producing an electronic printed circuit board (6; 25) are provided, which comprise connecting an electronic component (7; 27) to a printed circuit board (6; 25) by means of a lead-free solder containing Bi. The electronic component (7; 27) and the printed circuit board (6; 25) are connected to one another, followed by cooling of the solder at a cooling rate of approximately 10 ° to 20 ° C. per second. In the manufacture of an electronic circuit board (6; 25) by connecting components (7; 27) to the circuit board (6; 25) using a lead-free solder containing Bi, the solder is heated rapidly by irradiation with a pulsating beam and a rapid cooling of the same by the mass of the plate, which prevents the deposition of Bi. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-0249401-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1590861-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7156283-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1118411-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/FR-2818088-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021170338-A1 |
| priorityDate |
1998-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |