| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7af673589ca45d2fd8b9ea902cdbd1dc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0769
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-017 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C8-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C8-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49883
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C8-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-092 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-00 |
| filingDate |
1999-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d42dd4dfaf9c471273dddac15e94aba
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c939ddf11273adb66df672b30f0119c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5aeb1b08d3c2ab01babd9353cd80fd72
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_82d43884a798411a05b655b15f28ce30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5363a5b5a0920eb79d0bd82334c1aedd |
| publicationDate |
1999-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-19902125-A1 |
| titleOfInvention |
Insulating paste composition and conductivity paste composition and circuit board using the same |
| abstract |
A circuit board has a conduction suppressing agent between silver-containing wiring portions to prevent conduction in the silver deposited on the substrate between the wiring portions. Independent claims are also included for the following: (i) an insulating paste composition containing a potassium compound; (ii) a conductive paste composition comprising a dispersion of silver-containing metal powder and an inorganic binder in an organic vehicle and which also contains a potassium compound; (iii) a conductive paste composition comprising an organic dispersion of silver-containing metal powder and an inorganic binder formed of a substance which prevents evaporation of the silver from the metal powder; (iv) a conductive paste composition comprising a dispersion of silver-containing metal powder in an organic vehicle; (v) an insulating paste composition which is used between the wiring portions of the above circuit board and which comprises the conduction suppressing agent; (vi) a conductive paste composition which is used for the wiring portions of the above circuit board and which comprises the conduction suppressing agent; and (vii) methods of producing the above circuit board. |
| priorityDate |
1998-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |