http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-19855924-B4
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8f063b8222ec3c8e746a415e7f364473 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5ad8a37a24718df64d141eb0dd1a0372 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4ddcb273a108a5d8472b335280098e06 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76838 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-283 |
filingDate | 1998-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2006-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9a803af1fbe627caa1c36eab7b598364 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2be5cc36bf1e8adc18a90af109d74bda http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0a353aedc3a679ae7f3b299cd33d9553 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b39f95bd045eae941ae90c480327159a |
publicationDate | 2006-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | DE-19855924-B4 |
titleOfInvention | Manufacturing process for a compound |
abstract | A method of making connections used for a dielectric layer (202) having a metal contact (206) disposed therein, comprising the steps of: Forming a metal layer (212) on the dielectric layer (202); Applying a photoresist layer (218) to the metal layer (212) and etching the metal layer (212) such that a metal line (210) partially covering the metal contact is formed, and Removing the fat paint layer (218) using an oxygen plasma, Providing a pure water vapor plasma, wherein the flow of pure water vapor plasma is 300 to 500 sccm, and Treating the exposed metal contact with the pure water vapor plasma for 20 to 30 seconds, wherein a barrier layer (208) is formed between the dielectric layer (202) and the metal contact (206); forming a barrier layer (214) between the dielectric layer (202) and the metal layer (212); and an antireflection layer (216) is formed between the metal layer (212) and the photoresist layer (218). |
priorityDate | 1998-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.