http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-19833718-A1

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filingDate 1998-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c0e1a39af5d2b75f069110ed023396d8
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publicationDate 2000-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-19833718-A1
titleOfInvention Process for reducing particle release and particle absorption from a surface
abstract The invention relates to a method for reducing the particle release and particle absorption of a surface, in particular the surface of a wafer support in semiconductor production. DOLLAR A The reduction in particle transfer is achieved by coating the surface, which is created in a high vacuum by simultaneous vapor deposition of the surface with solid atoms and bombardment with ions. The solid atoms and the ions are applied to the surface in a stoichiometric ratio and are selected so that they form a hard layer. Before coating, the surface is cleaned and, if necessary, degreased. DOLLAR A The method according to the invention extends the service life of the coated surface in semiconductor production, since the cleaning effort is less necessary due to reduced contamination.
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priorityDate 1998-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 30.