| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e70dc2a52456dbd9c58f03b9ffcb69d2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81801
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01088
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01068
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-78301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-75
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-75303
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-75305
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13099
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05624
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01074
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1134
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0104
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-75302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-75745
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K20-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R43-0207
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-75
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-60 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K20-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-603
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R43-02 |
| filingDate |
1998-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f9d2d10ca6652af580bcc0904ab15b35
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b16c705c3481a7c0b6ca771fdfaedd1c |
| publicationDate |
1999-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-19828637-A1 |
| titleOfInvention |
Bonding device and bonding process |
| abstract |
The apparatus includes a bonding tool (90) for bonding a ball bump electrode of an electronic component to an electrode of a substrate. The tool has a pressure surface for exerting a pressure on the back face of an electronic component (10) and for guiding ultrasound to the electronic component. A substrate holder holds the substrate in such a way that the pressure surface of the bonding tool covers at least one main section of the back face of the electronic component. A bonding method using the apparatus is also claimed. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/SG-91934-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6585853-B2 |
| priorityDate |
1997-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |