| abstract |
Process for producing ceramic multilayer circuits, in which - be punched in unfired ceramic foils through holes (1), - the via holes are filled with a silver paste, - in a further step printed conductors (2) silver are printed on the slides, - The ceramic films are then stacked to form a film stack (3) and connected together in a pressing process, In a further step a sintering process takes place, characterized in that after the sintering process outer conductor tracks (4) and / or outer contacts (5) made of silver on the outer sides (10) of the film stack (3) are applied and that in a further step, a metallic protective layer of nickel and / or gold on the External conductor tracks (4) and / or external contacts (5) is applied, wherein the application of the outer conductor tracks and / or external contacts after the sintering process is carried out using a photo process. |