http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-19738118-C2

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filingDate 1997-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2001-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2744bfdead209b591d22380409ceb29c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bace3577454030a8226def64756a9fb4
publicationDate 2001-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-19738118-C2
titleOfInvention Assembly method for a semiconductor device
abstract The invention relates to an assembly method for a semiconductor component with a lead electrode, which consists of an alloy of two or more types of metals, which is formed on an electrode pad section of a semiconductor component by a laser ablation method, the lead electrode for electrically connecting the lead electrode to a connecting electrode section on one Circuit board is soldered back. The semiconductor device and the terminal electrode portion are encapsulated in resin by the laser ablation method.
priorityDate 1996-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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