abstract |
The invention relates to an assembly method for a semiconductor component with a lead electrode, which consists of an alloy of two or more types of metals, which is formed on an electrode pad section of a semiconductor component by a laser ablation method, the lead electrode for electrically connecting the lead electrode to a connecting electrode section on one Circuit board is soldered back. The semiconductor device and the terminal electrode portion are encapsulated in resin by the laser ablation method. |