| abstract |
In order to save time in making a glued joint between an electronic component (2) and a supporting substrate (1), whereby at least one component which is provided on one side with contact elements (3) at its periphery, for example a component like a flip-chip, is electroconductively connected to the contact surfaces (4) of the substrate which are turned towards the corresponding contact elements, and whereby a capillary flow glue (10) is introduced by means of a dispenser through a slot (8) between the component and the supporting substrate, it is suggested that a fluid capillary flow glue be applied onto the substrate through at least one opening (5) provided to that end in said substrate in such a way that it can spread between the at least one opening and the contact elements. |