| abstract |
A sensor, especially for conductivity and capacitance measurement in gases or liquids, includes an integrated resistance thermometer element (24) and preferably an integrated resistance heating element (42) in addition to a three-dimensional interdigitated electrode structure on a substrate. Also claimed is a process for producing a sensor, especially the above sensor, involving (a) carrying out sputter, photolithography and etching steps on one surface (1) of a preferably silicon substrate (2) to form a resistance thermometer element (24), preferably of Pt, Ni or TaNi, and optionally a resistance heating element (42); and (b) carrying out photolithography, sputter, etching and electroplating steps on a preferably opposite surface of the substrate (2) to form a three-dimensional interdigitated electrode structure (4). Further claimed is a method of direct boiling point determination in a liquid by using an integrated micro-structured resistance heating element (42) to heat a liquid volume within a three-dimensional interdigitated electrode structure (4) on a substrate (2) and then measuring the liquid temperature by means of a micro-structured resistance thermometer element (24) which is optionally integrated in the substrate. |