| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5b234c26247d74ea4f5d1252ac20191d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-36046 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-0543
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61F2-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1446
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61F9-08 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61F2-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61F2-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61F2-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61N1-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61N1-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61N1-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61F9-08 |
| filingDate |
1997-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
1998-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-19705304-A1 |
| titleOfInvention |
Method of manufacturing a semiconductor device, semiconductor device and use thereof |
| abstract |
The method involves manufacturing a semiconductor arrangement with a flexible carrier material which is equipped with a number of separate circuit components, whereby the carrier material is manufactured through thinning of a material with larger thickness. The circuit components are preferably micro-photo diodes, and the first material is composed of a rigid material. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2005087309-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-19921678-A1 |
| priorityDate |
1996-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |