http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-19681758-B4
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d7a9bad084a859a276838fb1ae64d151 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0195 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1572 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49124 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4069 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4617 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 1996-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2006-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0e75a981143cf1d97dd9a1ad182d0433 |
| publicationDate | 2006-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | DE-19681758-B4 |
| titleOfInvention | Single-sided circuit substrate for multi-layer circuit board, multi-layer circuit board and method of making the same |
| abstract | A single-sided circuit board (7a, 7b, 7c, 7d) for a multilayer circuit board (1), comprising: a one-side copper-clad laminate having an insulating hard substrate (2a, 2b, 2c, 2d) and a copper foil (13) adhered to a surface of the substrate, conductor circuit patterns (3a, 3b, 3c, 3d) formed on a surface of the substrate (2a, 2b, 2c, 2d) by etching a copper foil (13) of the copper-clad laminate; an adhesive resin layer (4a, 4b, 4c, 4d) formed on the other surface of the substrate, and conductive pastes filled in holes (5), wherein the holes (6a, 6b, 6c, 6d) are formed through the substrate (2a, 2b, 2d, 2c) and the adhesive resin layer (4a, 4b, 4c, 4d) in such a manner in that it is in contact with the conductor circuit patterns (3a, 3b, 3c, 3d) to provide through-holes. |
| priorityDate | 1996-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 25.